A
acronym
Guest
Also Bodo, scheint wohl kein neues Problem zu sein das wir da haben.
Ich zitiere mal Simons Antwort:
"I have had this problem on one or two builds and it was cured by reflowing the solder at ground points of the affected channel, specifically around the VCA and EG sections. I am aware that people have had problems soldering these points and it is due to slightly insufficient thermal relief around those points ie. heat is escaping into the surrounding ground plane whilst trying to heat the pad causing a bad joint. Unfortunately I’ve not been able to determine exactly which pad is responsible for the behaviour you describe but reflowing the areas I mentioned does fix the problem. You may need to repeat the process. Also try re-seating the ICs of the affected channels VCA and EG."
Ich zitiere mal Simons Antwort:
"I have had this problem on one or two builds and it was cured by reflowing the solder at ground points of the affected channel, specifically around the VCA and EG sections. I am aware that people have had problems soldering these points and it is due to slightly insufficient thermal relief around those points ie. heat is escaping into the surrounding ground plane whilst trying to heat the pad causing a bad joint. Unfortunately I’ve not been able to determine exactly which pad is responsible for the behaviour you describe but reflowing the areas I mentioned does fix the problem. You may need to repeat the process. Also try re-seating the ICs of the affected channels VCA and EG."